In recent years, with the integration of hardware mold industry adjustment, the competitiveness of the hardware mold is becoming more and more big, from past price competition gradually evolved into the research and development, improve the independent innovation ability will become a key support to improve the whole quality hardware mold.

To increase the intensity of technological innovation, relying on major r&d projects, break through the core and key technology. Also, to strengthen the construction of industrial talent team, including entrepreneurs team, professional and technical personnel, the industrial workers, the industrial talent pool, etc., in order to strengthen the independent innovation ability construction, improve the overall quality of industry to provide talent guarantee, in order to get rid of the accumulation in the process of development, weak capacity for independent innovation of parts and components of high external dependency, high-end products technology development is relatively backward, and market development capability is not strong, the future development of today's hardware mold industry has begun to mean, intelligent digital and ecological energy saving.

Hardware mold industry in China has become increasingly large, it is because of high production efficiency. In order to improve the production efficiency and the development of "a multi-cavity mould" technology is to wait until more and more widely used. Obviously, the same one injection molding process to manufacture more products at the same time, the production efficiency of natural double. And another reason is the parts is large, and this led directly to the mold must be large.

Mould large-scale, digital and ecological, energy conservation has been the important development trend of laser welding of high strength plate and different thickness plate stamping technology has more and more common and high strength steel plate hot stamping and large aluminum alloy plate stamping technology application in car production is also increasing; Due to the high speed punch speed more and more high, IC pin pitch is more and more close, connectors precision is higher and higher and smaller volume, so the ultra precision machining in further development.